WA6M214VA1TR500【PDF 1/5 页】CONN PLUG MICRO DIMM 214POS SMD

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COMPONENTS PRODUCT INFORMATION

NEW

0.4mm pitch Board to Board connector

WA6 Series

CONNECTOR

MB-0136-2

July 2006

RoHS 　 Compliant

< Outline >

The WA6 Series are 0.4mm pitch high density, compact connectors adapted to SMT,

for board to board (parallel board) connection with connector warpage prevention

feature, industry leading high pin counts, 214 position has been developed.

Low profile connector with 3 mm stacking height saves mounting space as much as

possible. WA6 has been employed as JEDEC standard for compact notebook PC

memory modules(214 pos., DDR2, Micro-DIMM). Best suits for high density mounting

and multi-pole interconnection of TVs and PCs interior mounting.

Features

Parallel board stacking height 3mm type low-profile design, No. of contacts: 214 pos.

Coplanarity of terminal portion held under 0.1mm.

Contacts for solder reinforcement are provided in each corner of the connector. (2

contacts x 4 corners, total 8 contacts)

Contact wiping length is 0.6mm.

Prevents solder wicking by integrated molding technology of contact and resin

mold.(Plug)

Compatible to automatic mounting

Both plug and receptacle have enough absorption surface for automatic mounting.

Products with kapton tape are available.

Available in embossed tape (width of tape; plug side: 56mm, receptacle side: 72mm)

Also available with and without a positioning boss, that secures correct positioning

when mounting.

No polar characteristics are applied to this connector.

General Specifications

No. of contacts :214 pos.

Contact resistance: 70m ohm max.

Dielectric withstanding voltage :

AC500Vr. m.s per minute

Operating temperature:

-55 Deg C to +85 Deg. C

Rated current: AC, DC each 0.3A/ per pin

Rated voltage: AC200CV

Insulation resistance: 100M ohm min.

Contact pitch: 0.4mm

JAE PMK Div. Proprietary. Copyright ? 　 2006 ， Japan Aviation Electronics Industry, Ltd.

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